JEDEC Progress in DDR5 RDIMM & UDIMM
DDR5 Market Info.
major players had already announced DDR5 successive since 1Q 2020, and began
delivery DDR5-4800 in 2021. Also, it’s expected to launch the advanced spec
DDR5-5200 and even DDR5-6400 by end of 2022.
As to CPU brands, Intel Sapphire Rapids as well as AMD Genoa are expected to launch by 4Q 2022, which both will support DDR5, PCIe 5.0 and CXL. NVidia will also introduce new GPU Hopper this year, and new CPU Grace for the next year, which both using PCIe 5.0 interface. The CPU market share would foresee to change: Intel decrease from 85% to 80%; AMD increase from 11% to 15%; ARM increase to 5% by end of 2022.
In summary, the generation of DDR5, PCIe M.2 Gen 5 has come. Argosy’s DDR5 RDIMM & UDIMM connectors have entered the stage of mass production, and deliver near 100K pcs shipment. PCIe M.2 Gen 5 is also ready for delivery.
JEDEC & Argosy DDR5 RDIMM & UDIMM Sockets Status
JEDEC published “DDR5 288 Pin U/R/LR DIMM Connector Performance Standard” in Aug. 2021.
In this standard, there were 28 reliability requirement fixed (mechanical, environmental & electrical). However, Signal Integrity- the frequency domain S-parameter determined to change to higher criteria, and the time domain remain the same in the 1Q 2022 meeting.
Though JEDEC decided not to disclose vendors’ test result, Argosy conducted self-test and pass the higher criteria, based on the standard and the recent frequency change.
In fact, we began to deliver DDR5 RDIMM & UDIMM connectors in 1Q 2021, and the yearly shipment is over 100K pcs. There are three reasons why customers are confident of our DDR5 RDIMM & UDIMM sockets.
(1) 3rd Parties Approved Best Performance
We joined DDR5 connector spec design with JEDEC & Intel since 2018, and launched DDR5 RDIMM sockets in 2019, and UDIMM in 2020. Here are the summary of Argosy DDR5 DIMM socket in 3rd party test performance.
- HPE & IEC tested 3D X-Ray solder joint performance “0% Defect Rate” as No.1 among 5 vendors in HPE DoE build, and conforms to IPC-A-610 Class 2 requirement (Jan. 2021)
- JEDEC High-Temperature Warpage performance No.1 among 8 vendors (Jun. 2020)
- Intel High-Temperature Warpage performance No.1 among 5 vendors(Sep. 2019)
- JEDEC Signal Integrity performance No.2 among 6 vendors (Aug. 2019)
Spec-in over 30 customers, including server brands, IDC, data centers, OCP projects, telecom, industrial, automotive and system integrators
(2) Excellent Design & Manufacture Capability
We stepped in DDR market since 2006, to manufacture DDR2 & DDR3 sockets. As technology transition, we continued to develop DDR4 (SODIMM, DIMM SMT & DIP types) and now the DDR5 (SODIMM, RDIMM & UDIMM) sockets.
Today, our DDR4/5 DIMM series production capacity achieves 9KK pcs per month, and we have out-of-China production site. With the increasing market demand, we keep expanding production in Taiwan & China, and plan to setup new site in ASEAN.
(3) With the Most Spec Combination
So far, we have developed over 50 spec options for DDR4/5 DIMM, including board lock types, varies latch design, housing & ejector colors. Here is our spec options.
To sum up, DDR5 and DDR4 DIMM have the same connector length, pin number and pin pitch; but slightly downsize housing thickness to save PCB space, increase data speed 50% by 6.4Gbps, decrease working voltage 30% by 1.1V. All the improvement encourages high-performance computing upgrade to DDR5.
Argosy works with JEDEC on DDR5, and exploit our design and production technology to provide reliable quality and stable delivery, and has become customers’ strong supply partner.
Find out the difference between DDR5 R/LR/UDIMM and DDR4 DIMM, clickhere to down “DDR5 RDIMM & UDIMM Introduction” (via Google drive)